Benchuang Electronics has been providing trusted PCB manufacturing and fabrication services since 2007. We pride ourselves on having the deep engineering experience and advanced technology and equipment to handle any project all the way from layout through assembly in our state-of-the-art facility. This includes fabrication and manufacturing of radio frequency (RF) and microwave PCBs.
• Layer count: 2~20L
• Board material: RO4350 B、Isola Astra MT77、RF35、RO4003 C、Ro3003、Ro3010、RT5870、RT5880、RT6010、Ro4360、TMM10、TMM10i、TACONIC RF series、TACONIC TLY series
• Double-sided process: RT5870、RT5880、RT6010、Ro4360、TMM10、TMM10i
• Hybrid: Ro3003、Ro3010、Ro4360、TACONIC RF series、TACONIC TLY series+ FR4
• Board thickness: 0.18mm(min)
• Size: 0.5″ X 0.5″ (min)(Shipping size)
• Min trace width/spacing: 0.005″/0.005″
• Tolerance of trace width / spacing: +/-8% trace width > 10mils and tolerance: +/-1mils
• Radius of Antenna width: 0.5mils(max)
• Min gap from Antenna to conductors: 3mils(min)
• Min thru hole size: 6mils (VIP resin filled) 8mils (VIP copper paste plugged)
• Min gap from hole edge to hole edge (Stitching via): 8mils
• Min gap from hole edge to copper (Stitching via): 6mils
• Aspect ratio: dielectric thickness / Laser drill hole size: 5mils / 6.50 mils(max) ( VIP plated shut )
• HDI: 6+N+6
• Layer to Layer Registration: +/-1.50 mils
• Tolerance of impedance control: +/-5%
• Cavity Process: Lamination (Adhesive Low Dk Low Df)+depth control milling
• Conductive via fill, Non-conductive via fill, Plated edges, Plated radii (castellation), Plated milling cutouts, Hard gold body, Soft bondable gold, Immersion gold, Immersion silver, HAL standard, HAL lead-free (ROHS), ENTEK (OSP)
