| Parameter | Standard Capability | Advanced Capability (Optional) |
|---|---|---|
| Microvia Types | Blind vias, Buried vias, Stacked microvias, Staggered microvias | Any-layer interconnection (ALIVH) |
| Laser-Drilled Microvia Diameter | 50 µm – 150 µm | As small as 30 µm |
| Microvia Aspect Ratio | ≤ 1:1 | Up to 1.2:1 (subject to evaluation) |
| Plating Reliability | Compliant with IPC-6012 Class 2/3 | Passes thermal shock testing (−55°C ↔ +125°C, 1,000 cycles) |
| Fill Method | Resin fill + plated shut | Conductive paste fill |
| Parameter | Capability Range |
|---|---|
| HDI Build-Up Types | 1+N+1, 2+N+2, 3+N+3 |
| Maximum Layer Count | Up to 22 layers (including microvia layers) |
| Minimum Line Width/Spacing (L/S) | 40 µm / 40 µm (standard) |
| Advanced: 30 µm / 30 µm | |
| Minimum Mechanical Drill Size | 0.15 mm |
| Minimum Laser Drill Size | 30 µm (UV laser) |
| Surface Finishes | ENIG, ENEPIG, OSP, Immersion Silver, Immersion Tin, Lead-Free HASL, etc. |
| Parameter |
|---|
1.High-Frequency & High-Speed Laminates: Rogers, Isola, Taconic, Panasonic Megtron series (Megtron 6/7/8), Shengyi S7135H, etc. 2.High-Tg Materials: Tg ≥ 170°C (e.g., IT-180A, KB-6167F) 3.Halogen-Free Options: Fully compliant with RoHS and REACH |
| Description | Production | Advancedz | |
|---|---|---|---|
| Inner Layer | Min.Trace/Space | 1.5mils / 1.5mils | 1.2mils / 1.5mils |
| Min. Copper Thickness | 1/3oz | 1/7 oz | |
| Max. Copper Thickness | 10oz | 30oz | |
| Min. Core Thickness | 2mils | 1.5mils | |
| Line/ pad to drill hole | 7mils | 6mils | |
| Line/ pad to board edge | 8mils | 7mils | |
| Line Tolerance | +/-10% | +/-10% | |
| Board Dimensions | Max. Finish Board Size | 19”X26” | 20”X28” |
| min. Finish Board Size | 0.2"X0.2" | 0.15"X0.15" | |
| Max. Board Thickness | 0.300"(+/-10%) | 0.350"(+/-8%) | |
| Min. Board Thickness | 0.007"(+/-10%) | 0.005"(+/-10%) | |
| Lamination | Layer Count | 60L | 100L |
| Layer to Layer Registration | +/-4mils | +/-2mils | |
| Drilling | Min. Drill Size | 6mils | 5mils |
| Min. Hole to Hole Pitch | 16mils(0.4mm) | 14mils(0.35mm) | |
| True position Tolerance | +/-3mils | +/-2mils | |
| Slot Diameter Tolerance | +/-3mils | +/-2mils | |
| Min gap from PTH to track inner layers | 7mils | 6mils | |
| Min. PTH edge to PTH edge space | 9mils | 8mils | |
| Plating | Max. Aspect Ratio | 28:1 | 30:1 |
| Cu Thickness in Through hole | 0.8-1.5 mils | 2 oz | |
| Plated hole size tolerance | +/-2mils | +/-1.5mils | |
| NPTH hole tolerance | +/-2mils | +/-1mils | |
| Min. Via in pad Fill hole size | 6mils | 4mils | |
| Via in pad Fill Material | Epoxy resin/Copper paste | Epoxy resin/Copper paste | |
| Outer Layer | Min. Trace/Space | 2mils / 2mils | 1.5mils / 1.5mils |
| Min. pad over drill size | 6mils | 5mils | |
| Max. Copper thickness | 12 oz | 30 oz | |
| Line/ pad to board edge | 8mils | 7mils | |
| Line Tolerance | +/-15% | +/-10% | |
| Metal Finish | HASL | 50-1000u” | 50-1000u” |
| HASL+Selective Hard gold | Yes | Yes | |
| OSP | 8-20u” | 8-20u” | |
| Selective ENIG+OSP | Yes | Yes” | |
| ENIG(Nickel/Gold) | 80-200u”/2-9 u” | 250u”/ 10u” | |
| Immersion Silver | 6-18u” | 6-18u” | |
| Hard Gold for Tab | 10-80u” | 10-80u” | |
| Immersion Tin | 30u”min. | 30u” min. | |
| ENEPIG (Ni/Pd/Au) | 125u"/4u"/1u” min. | 150u"/8u"/2u” min. | |
| Soft Gold (Nickel/ Gold) | 200u”/ 20u”min. | 200u”/ 20u” | |
| Metal Finish | S/M Thickness | 0.4mils min. | 2mils max. |
| Solder dam width | 4mils | 3mils | |
| S/M registration tolerance | +/-2mils | +/-1.5mils | |
| S/M over line | 3.5mils | 2mils / 2mils | |
| Legend | Min. Space to SMD pad | 6mils | 5mils |
| Min. Stroke Width | 6mils | 5mils | |
| Min. Space to Copper pad | 6mils | 5mils | |
| Standard Color | White , Yellow, Black | N/A | |
| Electrical Testing | Max. Test Points | 30000 Points | 30000 Points |
| Smallest SMT Pitch | 16mils(0.4mm) | 12mils(0.3mm) | |
| Smallest BGA Pitch | 10mils(0.25mm) | 6mils(0.15mm) | |
| NC Rout | Min. Rout to copper space | 8mils | 7mils |
| Rout tolerance | +/-4mils | +/-3mils | |
| Scoring (V-cut) | Conductor to center line | 15mils | 15mils |
| X&Y Position Tolerance | +/-4mils | +/-3mils | |
| Score Anger | 30o/45o | 30o/45o | |
| Score Web | 10mils min. | 8mils min. | |
| Beveling | bevel anger | 20-71o | 20-71o |
| Bevel Dimensional Tolerance | +/-10mils | +/-10mils | |
| Impedance controll | Impedance controll | +/-10% | +/-7% |
| Material Family | Common Grades | Typical Dk (Dielectric Constant) | Loss Tangent (Df) |
|---|---|---|---|
| Rogers | RO4350B™, RO4003C™, RO4835™, RO3003™, RO3006™, RT/duroid® 5880, 6002 | 2.2 – 6.15 | 0.0009 – 0.0037 |
| Isola | I-Tera® MT40, Astra® MT77 | 3.0 – 3.5 | 0.0017 – 0.0025 |
| Taconic | TLX, TLY, RF-35, TacOnic® RF-60A | 2.45 – 3.5 | 0.0009 – 0.0025 |
| Panasonic | Megtron 6 / Megtron 7 / Megtron 8 | 3.4 – 3.7 | 0.001 – 0.002 |
| Shengyi | S7135H, S6888G, SL1700 | 3.0 – 3.8 | 0.002 – 0.004 |
| Arlon / Park/Nelco | AD/CLTE, N4000-13SI | 2.5 – 3.5 | Low-loss options available |
| Parameter | Standard Capability | Advanced Option |
|---|---|---|
| Frequency Range Supported | Up to 30 GHz | Up to 110 GHz (with ultra-low-loss materials) |
| Impedance Control Tolerance | ±10% | ±5% (with full stack-up simulation & coupon testing) |
| Minimum Line Width / Spacing | 4 mil / 4 mil (0.10 mm) | 2.5 mil / 2.5 mil (0.063 mm) |
| Layer Count | 2 – 20 layers | Up to 32 layers (hybrid constructions supported) |
| Board Thickness | 0.2 mm – 3.2 mm | Custom thicknesses available |
| Copper Thickness | ½ oz – 2 oz | Up to 3 oz (for power + RF hybrid designs) |
| Surface Finish Options | ENIG, ENEPIG, Immersion Silver, OSP, Lead-Free HASL | Gold finger plating for connectors |
| Features |
|---|
1. Controlled Impedance Design: Single-ended, differential pairs, coplanar waveguide (CPW), microstrip/stripline 2. Back Drilling: Minimize via stubs for high-speed/RF signal integrity 3. Via Treatments: Plugged, capped, or filled vias to prevent signal leakage 4. Hybrid Laminates: Combine FR-4 with high-frequency cores for cost optimization (e.g., RF + digital sections) 5. Thermal Management: Metal-backed (Al/Cu) RF boards, thermal vias, and heatsink integration |
| Material Supplier | Popular Grades | Dielectric Constant (Dk) @ 10 GHz | Loss Tangent (Df) |
|---|---|---|---|
| Rogers Corporation | RO4350B™, RO4003C™, RO4835™, RT/duroid® 5880, 6002, CLTE-XT™ | 2.2 – 6.15 | 0.0009 – 0.0037 |
| Isola | I-Tera® MT40, Astra® MT77 | 3.0 – 3.5 | 0.0017 – 0.0025 |
| Taconic | TLX, TLY, RF-35, TacOnic® RF-60A | 2.45 – 3.5 | 0.0009 – 0.0025 |
| Shengyi | S7135H, S6888G, SL1700 | 3.0 – 3.8 | 0.002 – 0.004 |
| Panasonic | Megtron 6 / 7 / 8 | 3.4 – 3.7 | 0.001 – 0.002 |
| Arlon / Park/Nelco | AD1000, CLTE, N4000-13SI | 2.5 – 3.5 | Ultra-low-loss options |
| Parameter | Standard Capability | Advanced Option |
|---|---|---|
| Frequency Range | DC – 30 GHz | Up to 110 GHz (with ultra-low-loss PTFE/ceramic laminates) |
| Impedance Control | ±10% tolerance | ±5% (with full EM simulation & TDR validation) |
| Transmission Line Types | Microstrip, Stripline, Coplanar Waveguide (CPW), GCPW | Differential pairs, edge-coupled structures |
| Min. Line Width / Spacing | 4 mil / 4 mil (0.10 mm) | 2.5 mil / 2.5 mil (0.063 mm) |
| Layer Count | 2 – 16 layers | Up to 24 layers (RF + digital hybrid designs) |
| Board Thickness | 0.2 mm – 3.2 mm | Custom thicknesses for impedance tuning |
| Copper Thickness | ½ oz – 2 oz | Up to 3 oz (for power + RF integration) |
| Features |
|---|
1. High-Frequency & High-Speed Laminates: Rogers, Isola, Taconic, Panasonic Megtron series (Megtron 6/7/8), Shengyi S7135H, etc. 2. High-Tg Materials: Tg ≥ 170°C (e.g., IT-180A, KB-6167F) 3. Halogen-Free Options: Fully compliant with RoHS and REACH |
