| Features | Processing capacity (Shenzhen factory) | Processing capacity (Jiangxi plant) |
|---|---|---|
| Number of Layers (max) | 50 | 26 |
| Board Thickness Range | 0.2 mm--5.6 mm | 0.4 mm-- 3.5 mm |
| Outer Layer Linewidth/Spacing (min) | 3.0/3.0 mil | 4.0/4.0 mil |
| Outer Layer Copper Thickness (max) | 30 oz | 3 oz |
| Inner Layer Copper Thickness (max) | 15 oz | 3 oz |
| Board Thickness-to-Hole Ratio (max) | 20:1 | 10:1 |
| Board Thickness Tolerance | t≥0.8mm，±10% ; t<0.8mm，±0.08mm | |
| Finished Hole Diameter (Machine Drilling) | 0.15mm -- 6.50mm | |
| Hole Position Tolerance (Machine Drilling) | ±0.05mm | |
| Outer Layer Dimensional Tolerance | ±0.05mm (±2mi1) | |
| Minimum Solder Mask Bridge | 0.075mm(Green oil)/0.125mm(Variegated oil) | |
| Impedance Tolerance | <50Ω+52，≥50Ω±10% | |
| Surface Treatment | Tin plating (lead/lead-free), chemical plating, nickel-palladium-gold plating, tin plating, silver plating, OSP, etc. | |
