With production-matched thermal profiling and full validation.
We use the advanced Dage Quadra 7 system for X-ray inspection to support BGA rework and fault analysis. High-resolution imaging, oblique views, and IPC-A-610 certified visual inspection ensure exceptional qua...
We provide trim and form services for SMT and through-hole components. Custom tooling, MSL baking, JEDEC packaging, and post-process RHSD tinning ensure readiness for assembly and compliance with industr...
Automated component tinning using six robotic hot solder dip (RHSD) systems for finish conversion and gold mitigation. Fully compliant with GEIA-STD-0006 and J-STD-001, with leaded and lead-free processi...
Fast, flexible tape and reel services for SMT, through-hole, and custom components. EIA-481 compliant processing with inspection, ESD protection, MSL dry bake, and packaging per J-STD-033 and J-STD-0...
Circuit Technology Center and Keysight Technologies deliver a complete turn-key solution for testing DIMMs directly at BGA sites using W2630A series probes—enabling high-performance memory analysis with ex...
Restore damaged or worn gold edge contacts with our IPC-recommended brush plating process. We deliver precise, durable, like-new finishes that ensure full conductivity, meet specs, and extend the performance life of...
We deliver expert-level rework services for surface-mount, BGA, and through-hole components, using advanced equipment and IPC-trained technicians. We provide reliable solutions for the most complex challenges.
Trusted worldwide for precision BGA rework, we deliver IPC-compliant solutions for removal, reballing, pad repair, X-ray inspection, and circuit modification—backed by advanced systems and unmatched technical ex...
Trusted experts in high-precision circuit board modifications, we specialize in jumper wire installation, trace isolation, and complex ECO rework. Our skilled technicians ensure accurate, reliable results for the mo...
Our BGA Reballing delivers fast, precise, IPC and JEDEC-compliant rework for lead-free to leaded conversions. With advanced equipment, expert staff, and rigorous inspection, we ensure top-tier quality, reli...
Precision removal of underfilled BGA components using CNC milling systems. Ensures compliance with IPC-7711/7721 for high-reliability circuit board rework and repair.
Standardized process, exquisite craftsmanship, only to provide better products
Electrical verification against the same test program used in mass production.
Detecting defects after micro-repair — with same criteria as production.
Reballing with production-matched profile → X-RAY scan → void report.
Real-time thermal profiling on OK 7742 — top/bottom heat matched to client’s SMT reflow curve.
Browse our technical video library — all footage recorded in our AS9100D-certified lab.
How we replicate your SMT reflow curve on OK 7742 — with real-time thermocouple validation.
Full reballing of µBGA with SAC305, X-ray alignment, and post-rework void analysis (<3% voiding).
Replacing 0201 resistor on rigid-flex without damaging polyimide layer — 40x microscope view.
48-hour deployment for urgent ECN support — ITAR-compliant handling, full documentation.
Repairing damaged QFN thermal pad with copper foil + conductive epoxy — validated by TAKAYA.
Using X-ray CT + thermal imaging to locate micro-crack, followed by repair and validation.
Enterprise clients get private access to 50+ technical videos and SOPs.
