| Layer Count |
Rigid sections: 2–32 layers |
| Flex sections: 1–4 layers |
| Total layers: up to 32L |
| Materials |
Rigid: FR-4 (Standard, High-Tg, Halogen-Free) |
| Flex: Polyimide (Kapton®), LCP, PET |
| Adhesive: Adhesive-based or adhesiveless |
| Coverlay & Stiffeners |
• Coverlay: Yellow/Black PI, thickness 25–75μm |
| • PSR (solder mask on flex): optional |
| • Stiffeners: FR-4, Aluminum, Stainless Steel, Polyimide |
| Min. Line/Space |
Rigid: 0.05 mm / 0.05 mm (2 mil / 2 mil) |
| Flex: 0.075 mm / 0.075 mm (3 mil / 3 mil) |
| Min. Hole Size |
Mechanical: 0.15 mm (6 mil) |
| Laser (microvia): 0.075 mm (3 mil) |
| Bend Radius |
Static: ≥ 6× material thickness |
| Dynamic: ≥ 10× material thickness (for >500k cycles) |
| Dynamic Flex Life |
>500,000 cycles (adhesiveless PI, 1L) |
| >100,000 cycles (2L stackup) |
| Impedance Control |
±10% (single-ended) |
| ±7% (differential) — with 2D field solver validation |
| Surface Finish |
ENIG (2–5μ" Au), Immersion Silver, OSP, HASL (Lead-Free), ENEPIG |
| Quality & Testing |
• 100% AOI + Electrical Test |
| • Optional: 2D/3D AXI for buried vias |
| • Bend/flex validation per IPC-6013 |
| • Thermal shock: -55°C ↔ +125°C (10 cycles) |
| Certifications |
IPC-6013 Class 2 / Class 3 |
| ISO 9001, AS9100D, IATF 16949 |
| ITAR Registered |
| Lead Time |
Prototypes: 5–7 days |
| High-mix small batch: 7–10 days |
| Urgent (Top Priority): 72 hours |
