How we replicate your SMT reflow curve on OK 7742 — with real-time thermocouple validation.

Full reballing of µBGA with SAC305, X-ray alignment, and post-rework void analysis (<3% voiding).

Replacing 0201 resistor on rigid-flex without damaging polyimide layer — 40x microscope view.

48-hour deployment for urgent ECN support — ITAR-compliant handling, full documentation.

Repairing damaged QFN thermal pad with copper foil + conductive epoxy — validated by TAKAYA.

Using X-ray CT + thermal imaging to locate micro-crack, followed by repair and validation.