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  • IPC Class 2/3•UL Certified
  • AS9100D•IATF 16949
  • ITAR Registered•RoHS/REACH Compliant
  • 2–64L

    Layer Count
  • 72h

    Fastest Sample
  • 0.05mm

    Min. Line/Space
  • 99.98%

    Yield Rate

Why Fortune 500 R&D Teams Choose Httproto

DFM-First Engineering — Senior PCB engineers review every Gerber for manufacturability, impedance control, and thermal management — before production begins.

Advanced PCB Technologies for Critical Systems

From consumer electronics to defense systems — we manufacture to the highest reliability standards.

HDI PCBs

Ultra-high density for miniaturized,
high-performance electronics

Build Types I–V Laser Microvias Any-Layer

HDI Capabilities

  • Microvia: 0.075mm (3 mil)
  • Pad: 0.2mm (8 mil)
  • Stacked & staggered microvias
  • Embedded passives (resistors/caps)
  • 0.3mm BGA support

Applications

  • Smartphone mainboards
  • Medical implants
  • Aerospace avionics
  • AI accelerator cards
  • AR/VR headsets
  • Microvias PCB
  • Multiayer PCB
  • High Frequency PCB
  • RF PCB

Rigid-Flex PCBs

Hybrid circuits for space-constrained, high-reliability systems

2–12 Layers | Polyimide, Coverlay, PSR

HDI Capabilities

  • Microvia: 0.075mm (3 mil)
  • Pad: 0.2mm (8 mil)
  • Stacked & staggered microvias
  • Embedded passives (resistors/caps)
  • 0.3mm BGA support

Applications

  • Smartphone mainboards
  • Medical implants
  • Aerospace avionics
  • AI accelerator cards
  • AR/VR headsets
  • View more

Rigid PCBs

The workhorse of electronics — robust, cost-effective, high-volume ready

2–64 Layers | FR-4 High-Tg, Halogen-Free

HDI Capabilities

  • Microvia: 0.075mm (3 mil)
  • Pad: 0.2mm (8 mil)
  • Stacked & staggered microvias
  • Embedded passives (resistors/caps)
  • 0.3mm BGA support

Applications

  • Smartphone mainboards
  • Medical implants
  • Aerospace avionics
  • AI accelerator cards
  • AR/VR headsets
  • View more

Flex PCBs

Dynamic interconnects for high-flex, high-cycle applications

1–4 Layers | Polyimide, PET, LCP

HDI Capabilities

  • Microvia: 0.075mm (3 mil)
  • Pad: 0.2mm (8 mil)
  • Stacked & staggered microvias
  • Embedded passives (resistors/caps)
  • 0.3mm BGA support

Applications

  • Smartphone mainboards
  • Medical implants
  • Aerospace avionics
  • AI accelerator cards
  • AR/VR headsets
  • View more

Metal Core PCBs (MCPCBs)

High-power thermal management — LED, power electronics, EV systems

1–4 Layers | Aluminum, Copper, Ceramic

HDI Capabilities

  • Microvia: 0.075mm (3 mil)
  • Pad: 0.2mm (8 mil)
  • Stacked & staggered microvias
  • Embedded passives (resistors/caps)
  • 0.3mm BGA support

Applications

  • Smartphone mainboards
  • Medical implants
  • Aerospace avionics
  • AI accelerator cards
  • AR/VR headsets
  • View more