Industrial Control 4/6 Layer PCB Engineering Specifications
Our 4-layer and 6-layer PCBs engineered for industrial control systems are built to withstand the harsh operational conditions of factory floors—far exceeding generic manufacturing benchmarks. The 4-layer PCB leverages high-Tg FR-4 material with a glass transition temperature of ≥170°C, enabling stable performance across a -40°C to 85°C temperature range. Equipped with 3/3mil line width and spacing, plus 0.2mm via diameters, this board supports 24V industrial power inputs while incorporating dedicated anti-interference shielding between signal and power layers. For complex programmable logic controllers (PLCs), the 6-layer variant adds an independent ground plane, cutting electromagnetic interference (EMI) by 30% compared to 4-layer designs. It integrates 0.15mm blind vias to eliminate signal crosstalk from through-holes, with full compliance to IEC 61010 industrial safety standards for hazardous electrical equipment.
Multilayer PCB Lamination
Materials used in the lamination process include: inner layer core, sheets of “prepreg” (woven glass cloth with epoxy resin), and sheets of Cu foil. Tooling holes in each sheet of materials and core are used to align them as they are stacked up. For a 4 layers board, the bottom would be a sheet of foil, followed by a specific number of sheets of prepreg, the inner layer core. It is followed by more prepreg and finally the top sheet of foil. The stack of panels is built on a heavy metal plate and when it is completed a top plate is added creating a “book”. The book is then moved to a heated hydraulic press.
Multilayer PCB Wrap Plating
Wrap plating is where the drill hole is plated with copper as the plating extends from the hole drilled onto the board and onto the surface. This plating is made from copper; it extends from around the via structure and under the cap plating to move out from the surface.
There are different class specifications regarding the thickness of the electrolytic hole plating thickness. The IPC-6012 standard (and IPC-A-600 inspection standard) has a Class I, Class II, and Class III categories. Class I thickness specifications merely state that the thickness will be as agreed between the user and the supplier (AABUS). This is the least option used by most production facilities.
4 Layer PCB
With miniaturized electronic products becoming ubiquitous, the need for small circuit boards is on the rise. Multilayer circuit boards are therefore the order of the day. A 4-layer PCB stackup is becoming increasingly common. Let us look at the 4-Layered PCB in detail.
4 layers stackups are a popular jumping-off point for simple designs. As a cheap build with high design manufacturability, the four-layer design still exists alongside more intensive and expansive boards in today’s design world. Deciding upon a four-layer stackup begins by analyzing the number of components for placement and the routing needed.
•Blind vias, buried vias, Ultra HDI PCB
•High frequency low loss PCB material
•Low loss high speed PCB materials
•R-5775, R-5785, R-5795, TU-872 SLK , TU-872 SLK SP, TU 933+, I-Tera MT40, Astra MT77, Tachyon 100G material
•EM-888, EM-888(S), EM-888(K), EM-526, EM-528, EM-528K, IT-968, IT-968 SE, IT-988G, IT-988G SE material
