When it comes to high frequency PCB design, it’s important that the design engineer collaborate with the PCB supplier to select the materials for the desired frequency performance requirements and to establish the correct stack-up. Benchuang has deep engineering capabilities and experience with control depth drilling, control depth milling, and back drilling, unlike some of our competitors. This means we have the technology, the experience, and the knowledge to help you design and build the right high frequency PCB from the start.
We differentiate ourselves by being able to take on all complex jobs — all the way from layout through assembly — and we do this under one roof with state-of-the-art technology and an extensive engineering team. This end-to-end expertise allows us to excel at the entire process and be the best PCB provider in the word.
• Hybrid or Mixed Dielectric Boards (PTFE/FR-4 combinations)
• Board material: I-Speed、I-Tera® MT40、Tachyon-100G、Isola Astra MT77、Megtron 6 R-5775、Megtron 7 R-5785、Megtron 7N R-5785N、RO4350 B、RO4835、RO4003、RO4533、IT-968、IT-968 SE、IT-988G、IT-988G SE、EM-528K、EM-890K、TU-883、TU-883SP
• Cavity Boards (Mechanical and Laser Drilled)
• Edge Plating
• Constellations
• Large Format PCBs
• Front to back registration of etched cores to +/-0.05 mm
• +/- 0.0.025 mm tolerance on etched features for un-plated 1oz copper
• Blind/Buried, Via-in-Pad, Micro Vias, Stacked Vias, and Laser Via’s
• Soft Gold and ENEPIG Plating
• Sequential lamination
