Flexible printed circuit boards (FPC) are offering the highest level of 3D miniaturization. Very low bending radii in combination with ultra-HDI (ultra-high density interconnect) are enabling our customers to build increasingly smaller and highly integrated devices. This technology is an enabler of small wearable devices as well it provides high signal density.
Benchuang Electronics has been a market leader in this field for many years and is manufacturing flex circuits with a layer-count of 1 to 16. We are working with polyimide foils as thin as 12.5 µm (0.5 mil) and adhesive bond plys starting at a thickness of 12.5 µm (0.5 mil). Our state of the art equipment is enabling us to produce FPCs with high output, reliability and repeatability. Depending on the dielectric thickness, laser drilled blind vias can be as small as 30 µm (1.4 mil) in diameter, and can be filled with copper in the subsequent plating process. This plating technology is enabling the use of stacked vias and via-in-pad structures.
• Turnkey flex solutions targeting 3D miniaturization
• Highly reliable, extremely robust multilayer flex/microvia substrates
• Ultra-thin base materials
• Filled via and stacked via process available
• Complex mechanical/assembly assist features, including special profiles, fold lines, cut-outs
• and thinned bending zones/cavities
• Wrap-around boards
• Chip-on-flex (COF), chip scale packaging (CSP) substrates, and BGAs
• A wide variety of surface finishes, for example; OSP, ENIG, ENEPIG, E-AU, DIG
• Flying leads
• Bending test for flexible circuits
• Ultra-fine line flex cables
