Actionable insights to avoid costly re-spins, delays, and quality escapes.
• DFM/DFA issues (trace/space, impedance, thermal)
• BGA/0050 assembly feasibility
• HDI stackup & via reliability
• Metal core thermal path validation
• Component obsolescence warning
• Single-source dependency flags
• Lead time bottlenecks
• Counterfeit risk assessment
• Test coverage gaps (ICT/FCT)
• Inspection point recommendations
• MIL-STD-883 compliance check
• Reliability test plan (thermal shock, vibration)
Actionable insights to avoid costly re-spins, delays, and quality escapes.
| Document Type | Purpose | Required? |
|---|---|---|
| Gerber / ODB++ Files | PCB stackup, layer count, impedance control | ✓ Required |
| BOM (Excel/CSV) | Component sourcing & availability check | ✓ Required |
| Centroid File | SMT placement & test point analysis | Recommended |
| Mechanical Drawing (STEP/PDF) | Thermal, structural, and enclosure fit | Recommended |
| Project Timeline | Urgency level & milestone alignment | Optional |
Your goals, timeline, and critical requirements
PCB stackup, component placement, thermal, signal integrity
Component availability, lead times, alternative suggestions
Risk mitigation steps, timeline adjustment, next actions
Available slots: Mon-Fri, 9AM–5PM (CST)
