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| Material: |
FR-4
|
| Board Type: |
1
2
3
4
5
6
7
8
9
|
| Size(single): |
TG 130
TG 150
TG 170
|
| Layer Count: |
Single pieces
Panel by Customer
Panel by NextPCB
|
| Different Designin Panel : |
1
2
3
4
|
| *PCB Panel Array: |
X
mm
inch'←→ mm
 |
| *Quality: |
pcs
|
| *Break-away Rail: |
|
| PCB Thickness: |
0.6
0.8
1.2
1.4
1.6
1.8
2.4
3.2
>=1.7-6.0
* Unit: mm
|
| PCB Solder Mask: |
Green
Red
Yellow
Blue
White
None
Black
Matte black
|
| Silkscreen: |
White
Black
|
| Electrical Test: |
Sample Test Free
|
| Finished Copper: |
1 oz Cu
2 oz Cu
|
| Min.Track/Space Outer: |
10/10mil
8/8mil
6/6mil
5/5mil
4/4mil
3.5/3.5mil
 |
| Min.Drilled Hole: |
0.3mm 个
0.25mm 个
0.2mm 个
0.115mm 个
|
| Via Process : |
Tenting vias
Vias not covered
Solder Mask PlugllV-B)
Non-Conductive Fill & Cap[Vll)
*For Gerber files this choice will not affect anything, PCB will be made using the parameters of the files. |
| Surface Finish: |
HASL with lead
HASL lead free
ENIG
OSP
|
| Special Process: |
HDl(Buried/blind vias)
Impedance
Beveling of G/F
Plated Half-holes/Castellated Holes
|
| X-out: |
Accepts
Not accepting
|
| Report Format: |
Paper
Electronic
|
| UL Mark: |
UL+Week/Year
UL+Year/Week
Case Display
|
| Special Requests: |
|
