For special requirements not avaliable on this page, please send your requirements and Gerber files to us and we will come back to you with a price in 2 working days
| PCB Type: |
Through hole board
HDl(Buried/blind vias)
|
| Board Spec: |
IPC 6012 Class 2
IPC 6012 Class 3
IATF16949
IS013485
Customer Standard
|
| Different Designin Panel: |
Single pieces
Panel by Customer
Panel by NextPCB
|
| Different Designin Panel: |
1
2
3
4
5
6
|
| *Size(single): |
X
mm
inch'←→ mm
 |
| *Quality: |
pcs
|
| *Layers: |
1
2
3
4
5
6
1
2
3
4
5
6
1
2
3
4
5
6
1
2
3
4
5
6
|
| Material: |
Tg140 FR-4
Tg150 FR-4
Tg170 FR-4
Tq150 FR-4(Halogen-free)
Tg170 FR-4[Halogen-free)
High-CTI(>=600V)
High-CTl[Halogen-free,>=600V)
=High SpeedlGHz)
=High Frequency PCBs(DK)
Special MaterialHigh low temperature)
*Tg140 FR-4 Material: Shengyi S1141 |
| Thickness: |
>0.1-0.2(reviewed)
2
3
4
5
6
1
2
3
4
5
6
1
2
3
4
5
6
1
2
3
4
5
6
* Unit: mm
|
| Solder Mask: |
Green
Red
Yellow
Blue
White
None
Black
Matte black
|
| Silkscreen: |
White
Black
|
| Edge connector: |
Yes
No
|
| Surface Finish: |
HASL lead free
lmmersion gold{ENlG)
OSP
Hard gold
lmmersion silverlAg)
Immersion Tin
ENEPIG
NonelPlain copper)
|
| Finished Copper: |
1 oz Cu
2 oz Cu
2 oz Cu
2 oz Cu
2 oz Cu
2 oz Cu
2 oz Cu
2 oz Cu
2 oz Cu
2 oz Cu
2 oz Cu
2 oz Cu
2 oz Cu
|
| Min.Track/Space Outer: |
10/10mil
8/8mil
6/6mil
5/5mil
4/4mil
 |
| Min.Drilled Hole: |
0.3mm 个
0.25mm 个
0.2mm 个
0.115mm 个
No Drill
 |
| Peelable Soldermask: |
|
| Hole copper thickness: |
|
| UL Marking: |
|
| Date Code: |
|
|
Half-cut/Castellated Holes Layers
Edge Plating Layers pcb help
Impedance control Layers
Custom Stackup
Carbon Mask
Via in pad/ Via filled with resin
Countersinks/Counterbores
Via filled with copper
Z-axis milling
Black FR4 (black core)
Press-fit holes
Embedded Copper PCB?
Embedded Capacitor/Resistor PCB
Whole/Partially Hybrid PCB
Cavity PCB
Backplane PCB
Semi-Flex PCB
Leadless Partially Plated Hard Gold
|
| Final Inspection Report(free): |
HASL lead free
lmmersion gold{ENlG)
OSP
Hard gold
lmmersion silverlAg)
Immersion Tin
|
| Other Special request: |
|
| Stencil type: |
Framework
Non-framework
 Allow combining several PCBs on a single SMD stencil. |
| Multi-level/Step Stencil: |
Yes
No
|
| Size(mm): |
370x470mm(Valid area 190x290mm)
|
| Stencil Side: |
Top
Bottom
Top+Bottom(On Single Stencil)
Top & Bottom(On Separate Stencil)
|
| *Quality: |
pcs
|
| Thickness: |
2.0mm
3.0mm
4.0mm
5.0mm
6.0mm
1.0mm
2.0mm
3.0mm
4.0mm
5.0mm
6.0mm
|
| Existing fiducials: |
None
half lasered
lasered_through
|
| Electropolishing: |
Yes
No
|
| Other Special request: |
|
| 3 flexible options: |
Turnkey (pcbasic supply parts)
Kitted or Consigned (Customer supply parts)
Combo (You supply some partswe do the rest)
|
| Board type: |
We suggest choose to do panel if single PCB qty is more than 20pcs or any side of single board is smaller than 50mm. |
| Assembly Side(s): |
|
| *Quality: |
pcs
Please fill in total quantity of single PCBs. |
| *Pay attention: |
|
They can be left blank if you're not sure about the number of Unique Parts, SMT Parts, BGA/QFP Parts or THT parts.
| Number of Unique Parts: |
|
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| Number of SMD Parts: |
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| Number of BGA/QFP Parts: |
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| Number of Through - Hole Parts: |
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| Board type: |
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Board type: |
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| Board type: |
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Board type: |
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| Board type: |
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Board type: |
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| Board type: |
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Board type: |
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| Board type: |
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| Other Special request: |
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Price does not include PCB fabrication or the cost of components, exact quotation will be updated after all the files you uploaded pass review or contact HTTproto for help.
